Macro Inspection
![Macro Inspection](assets/images/6/Makro_-e67b90b6.jpg)
Macro inspection and documentation: The wafer handling system is equipped with different selectable light sources. On the one hand with a homogeneous light field plate for bright field inspection and on the other hand with a dark field light source for the inspection for particles, scratches etc.
3D Bond Control
![Bond Kontrolle](assets/images/d/Bond_Pruefung_-62d682bd.png)
Testing of wedgebonds and ballbonds with 3D microscopy.
White light interferometrie and confocal microscopy in conjunction with special software modules.
Wafer Handling
![Wafer Handling](assets/images/8/Waferhandling_-51517e78.jpg)
Robots and prealigner according to the requirements and eligible accessories for:
- Vacuum backside handling
- Vacuum edge handling
Vacuum Gripping Technology
![Vacuum Gripping Technology](assets/images/6/Greiftechnik%20Vakuum_-e3fdc736.jpg)
To solve various measurement and inspection tasks, Promicron relies on a large number of optical methods. They are combined according to requirements and customer request.
Edge Gripping
![Edge Gripping](assets/images/4/Grip%20%20Waferhandling_-b9b2ba04.jpg)
An edge gripper takes up a substrate (such as a wafer) and releases it again. To solve various measurement and inspection tasks, Promicron relies on a large number of optical methods. They are combined acoording to requirements and customer request.
Bonded Wafers
![Bonded Wafer](assets/images/a/wafer-rueckseite-makroinspektion-251ff97a.jpg)
Bonded wafers are considerably thicker than single wafers and can have an offset. They may be non-circular. To solve various measurement and inspection tasks, Promicron relies on a large number of optical methods. They are combined acoording to requirements and customer request.
Bow & Warp Wafer
![Bow & Warp Wafer](assets/images/8/Bow%20Warp%20DSC_7289_-68f42958.jpg)
Promicron offers proven solutions for safe wafer handling, even for those with clear bow/ warp, to ensure a safe handling.
By using corresponding soft- and hardware modules, the measurement and graphic representation of the wafer bow / warp is possible as well.
Wafer Chuck
![Wafer Chuck](assets/images/4/Chuck_-19278f34.jpg)
Promicron uses various methods (e.g. friction or vacuum) and adapts them according to the given requirements and the customer' request.
Wafer on Tape
![Framed Wafer Wafer Dicing - Sawn wafers on tape](assets/images/a/gesaegte%20Wafer%20auf%20Tape_-0a4f58ba.jpg)
Vakuum Chucks with a finest porous surface for sawn wafers on blue tape. Even wafers with minute dies are sucked in safe and even.
Wafer Dicing Inspection
![Sawing Line Alignment Overlay Messurement](assets/images/2/Dicingline_Overlay_measurement_-402efc52.jpg)
Inspection and metrological control of the sawing lines on:
- Missmatch or alignment error
- Saw depth
- Chipping
QR Code Reading
![QR Code Reading](assets/images/4/QR_code_reading_on_microscope_-ebbb23a4.jpg)
QR codes and barcodes or plain text can be read automatically through external adapted reading devices (code reader) or possibly in the camera image of the microscope.
Mask Inspection
![Mask Inspection Robothandling Reticle Inspection Handling](assets/images/a/PROMIS_C_MaskInspection1_-a4b6422a.jpg)
Inspection of masks used to produce wafers.
The task of the inspektion is to detect random errors (scratches, particles) and systematic / structural faults.
Chrome on glass substrates are usually inspected in transmitted light - incident light and dark field can also be used.
Within the scope of the measurement, quality parameters of existing masks (e.g. abrasion) can also be checked.