Technologies
White Light Interferometry
- Fast and reliable tool for the non-contact determination of three-dimensional surface topographies of micro- and nanostructures.
- Microscope equipment based on INM/Ergoplan or DM8000 with interferometer hardware and software for measuring topography and exporting 3D data.
The measurements are based on the interferometry method. This is based on the ability of light waves to overlap in a spatially and temporally coherent manner. The light is split using a beam splitter. Part of the light reaches the object surface, the other reaches a reference mirror and creates a reflection. Due to the parallel recording and processing of the measuring points, height information can be obtained over a large area and in a very short time.
Typical tasks in quality assurance and research are the characterization of surfaces with varying degrees of roughness (wafer structures, mirrors, glass, metals), the determination of step heights and the precise measurement of curved surfaces, such as microlenses. The efficient, robust and highly accurate evaluation algorithms contained in the software are the result of extensive research.
Confocal Microscopy
White light confocal microscopy is a highly versatile and robust method for obtaining laterally and especially longitudinally high-resolution 3D geometry data. The confocal imaging significantly reduces the depth of field, especially with high-magnification lenses (20x, 50x or 100x), and in combination with the evaluation software results in an extremely powerful 3D surface topography measuring device.
Confocal microscopy uses spirally arranged apertures on a Nipkow Disk to block out-of-focus light, enabling precise imaging from the focal plane. The rapid disk rotation ensures that the apertures in their entirety cover every point of the image field, creating a real-time confocal image slice. A vertical scan with nanometer-thin steps produces a Z-stack for 3D data, which is processed and analyzed using MCS confocal software.
This method offers enormous speed compared to laser scanning techniques but requires strong lighting sources. It excels in resolution, especially with objectives of high numerical aperture. Its versatility allows for use with reflective samples, significantly enhancing microscopy capabilities. The SDC confocal module, available for INM series microscopes, combined with MCS confocal software, transforms the microscope into a powerful tool for 3D surface analysis.
Infrared microscopy
Part of our specialization is infrared microscopy.
We have build up excellent expertise here over the years and are constantly expanding it wht new challenges customers tasks.
We offer IR-Inspections or metrology tasks such as CD- or overlay-measurements of bonded wafers. Bond ring inspections and error classifications using deep learning or golden template matching are also possible.
Reflectometry
Reflectometry can be used to measure various properties of surfaces and materials. We use reflectometry to determine thin transparent and semi-transparent layers. The method is non-destructive, fast and non-contact.
A beam of light, of a specific wavelength range, is directed at the thin layer to be analyzed. At the interfaces of the layer (e.g. air-layer, layer-substrate), the light is partially reflected and partially refracted (enters the layer). The light rays reflected at the various interfaces overlap (interfere). Depending on the thickness of the coating and the optical properties of the coating material, constructive (amplification) or destructive (attenuation) interference occurs. A spectrometer measures the intensity of the reflected light as a function of the wavelength. The result is a reflection spectrum.When analyzed, the measured reflection spectrum is compared with a theoretical model.
With thin-film measurement technology using reflectometry, we rely on a high-performance method for determining thin films. It offers a combination of high accuracy, speed and non-destructive measurement, making it an important tool in the semiconductor industry.
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