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On the base of a fully motorized high-end microscope the ProMicron MCS-OWI software supports the requirements of a constantly reliable visual inspection in terms of your quality assurance requirements.
- optical visual wafer inspection according to AQL (acceptance quality level) criteria
automatic wafer inspection import/export of test maps, ink files
- defect classification, defect image database
- infrared through wafer, NIR inspection
- UV optics and illumination
- options: ink dot system, wafer loader.
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Features:
- Vistec/Leica INM 200
- automatic hight performance microscope
- high precision X/Y positioning
- realtime laser autofocus
- wafer size from 100mm bis 200mm d
- clean room category 1 compatibel
- easy handling
- high reliability
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The clearly structured computer interface displays besides the live picture of the digital camera and also the wafermap and control elements of microscope, waferloader ect.. Thanks to the high-class ergonomy of the system the operator is able to concentrate on his inspection duties for hours. For each of the programmed inspection issues the whole bunch of microscopical possibilities is available. |
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That is: highest optical capability with maximum zoom from 25x to 1500x (max. up to 3000x) and all important microscopical contrast methods(bright field, darkfield, interference contrast, confocal). |
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The motorized xy stage in combination with the dynamic laser autofocus always enables an exact positioning and focussing of the specimen. Of course you can always interfere manually,i.e. in order to look at another focus level or inspect a nighbouring chip before the programmed process continues. The operator is able to assign defect codes and save the images with the relating position coordinates. Optionally bad dies can be inked, whereas an actual inkmap is created. At the end of the inspection there are lot- and wafer- related data of good chips and statistics (relating to the occured defects and its allocation) available. |
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mcs is multifunctional and thus suitable for several tasks
- manual inspection and review
- CD-measurement
- structure measurement
- automatic surface inspection
- contact-free layer thickness measurement
- pattern recognition for automatic measurement and inspection
- macro inspection with image and results database
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...a system
- flexible and modular with plug in interface to customize its functions
- special features
- export functions
- preconfigured measuring processes and much more
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Due to the small focal length of a light microscope, it is sometimes necessary to make a sequence of monoscopic images, scanned step by step with a constant change of the focussing distance between consecutive images to get a sharp representation of a 3D object. The composed image is then calculated from this sequence by combining the sharp regions (optical cuts) of the raw images. |
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...easy to integrate in process structures
- various import and export possibilities for measuring processes
- mapping and image processing data
- reporting with statistics, graphs and export of results in several formats (ASCII, XML, Excel, HTML...)
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...mcs connects to
- automated microscopes with high performance measuring processes and contrast methods
- application specified camera systems
- interferometric and confocal sensors
- motorized xy stages
- wafer loader / sorter
- wafer ID reader for fully automated processes
- ink systems for physical and virtual inking
...and offers
- comprehensive user support such as a comfortable assistant function in order to teach-in measuring and inspection programs quickly and easily
- interactive map-view with position display or direct positioning of the xy stage
- exact navigation via mouse click in the live image
- comprehensive documentation with image and results data archive for
time-delayed off-line analysis. |
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System Options On the base of the same hard and software platform we also offer systems for overlay and layer width or thin film measurement. A completely new equipment option is the microscopic NIR camera-inspection by silicium which is transparent in the near infrared spectrum. We have all capacities to adapt the systems to specific requirements or substrate forms. Mechanical construction facilities, CNC production lines and opto-electronical development resources are available. There are, for instance, specific substrate forms possible (see i.e. image: film substrate / roller to roller processing). |
