Backend Optical Microscope Inspection

On the basis of a fully motorized high-end microscope the ProMicron MCS-OWI software supports the operator during the visual inspection and provides the basis of a constantly reliable optical inspection just as your quality assurance team needs it.

On the clearly structured user interface, the wafermap and the control elements of the microscope, waferloader etc. are displayed in addition to the live view image of the digital camera.

Similarly, the integration of quality assuring systems and devices such as AQL (Acceptable Quality Level) are available for inspection lot testing and can be implented, if requested.

Thanks to the high-class ergonomics of the system, the operator is able to concentrate on his inspection tasks for hours. For each of the programmed inspection spots the whole range of microscopical possibilities is available.

That is: highest optical capability with magnifications of 25x to 1500x (a maximum of 3000x) and all important microscopical contrasting methods (bright field, darkfield, interference contrast, confocal).

The motorized xy-stage combined with the dynamic laser autofocus enables an exact positioning and focussing of the specimen.

Of course you can always interfere manually, e.g. look at a different focus level or inspect a close-by chip before the programmed process continues.

The operator is able to assign defect codes and save the images connected to the relating position coordinates. Optionally bad dies can be inked, while at the same time a map of inked dies is created.

At the end of the inspection there are lot- and wafer- related data of good chips available and a statistics concerning the occured defects and their distribution is calculated.

Based on the same hardware and software, we also offer systems for overlay and layer width as well as for thin film measurement.

Image clickable for higher resolution version.

A completely new equipment option is the microscopic NIR camera-inspection by silicium which is transparent in the near infrared spectrum.

How can we help you?
We have all possibilities to adapt the systems to suit your specific requirements or substrate forms.

Mechanical constructions, CNC production machines and opto-electronical development resources are available.

There are, for instance, specific substrate forms possible (see example illustration: film substrate/roller to roller processing).

Have you experienced the following scenario?
You receive a delivery of wafers. One of the wafers is obviously damaged (e.g. has scratches). You would love to just send the whole delivery back with the contractor, but you have customers waiting yourself and thus you are forced to have a closer look at the wafers and sort out the ones, you will still be able to use in order to satisfy your own customers.

Features:

KLA-Tencor INM 200 or INM 300 (former Vistec/Leica)
Automated high performance microscope
High precision at x/y positioning
Real-time autofocus
Wafer size of 100mm up to 300mm diameter
Compatible to clean room class 1
Good usablility
High reliability

Supervisor:

Wafermapping (manual input of border dies="ugly dies") or import of pass/fail Mapping Tester (post inking)
Manual choice of observed chips
random choice (absolute number or precentage), with those -> creating an inspection file i.e. setup with all system settings
Microscope settings (magnification, contrasting method HF/DG, aperture), if needed: illumination settings
if needed: camera settings, complete setup by saving as an inspection file (unlimited number of inspection files)
Definition of micro scans:

a) by manual teaching via joystick (autofocus on or off by selection, selecting objective magnifications, select HD/DF by position)

b) by meander shaped stage movements on dies in steps relating to image fields
c) alternatively: one mode is for continual observing
thereby starting and endpoint are calculated automatically depending on the chosen objective

Operator approach:

Start the inspection programm

Approach of reference points

Ink bad dies, ink-map settings

Output statistics/if necessary: physical inking

Automated Wafer Transport

System Options

On the same hardware and software platform, we also offer systems for overlay and linewidth measurement techniques or coating thinfilm measurement.
A completely new equipment option is the microscopic NIR camera inspection by the near-infrared transparent silicon.
In our shop we have all posibilites to adapt the systems to meet your specific requirements or substrate forms.
Mechanical constructions, CNC manufacturing equipment and opto-electronic development resources are available for this purpose.
Thus, for example, even special substrate forms are possible (see example Figure substrate film roll to roll processing).

Microscope Control Software for Optical Wafer Inspection